Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...
Abstract: Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the ...
Abstract: In recent years, electronic devices have been evolving towards higher power densities. As the size of electronic devices continues to shrink, the issue of component temperatures has become ...
Ansys Inc has announced the latest release of Ansys Icepak software, which provides fluid dynamics technology for electronics thermal management. The 12.0 release introduces new features for ...
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