Objective: Currently, there is no standardized finite element analysis method for investigating the safe compression range of circular end-to-end anastomosis stapler. This study aims to develop a ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

The author prepared and analyzed a detailed design of experiments for the manufacture of a simple tablet formulation. The aim was to test whether tablet hardness and weight could be controlled during ...