With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...
Santa Clara, CA and Boise, Idaho, Apr 15, 2010 - (JCN Newswire) - American Semiconductor, Inc. (本社: 米国アイダホ州ボイシ、以下American Semiconductor)は本日、自社のFlexfetテクノロジおよびSILVACO, Inc. (本社: ...