Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today’s high pin count, ...

Abstract: With the increasing operating frequency and integration density of ball grid array (BGA) packaging in high-performance systems, radiation leakage, and signal interference from solder balls ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.