US tech giant says four out of the six new chips that make up the new Rubin computing platform were developed by engineers at ...

Data Center Building Block Solutions (DCBBS) and Advanced Direct Liquid Cooling (DLC) Technology with Supermicro US Based In-House Design/Manufacturing Accelerate Time to Deployment of Next Generation ...

Together, ZF and Qualcomm Technologies aim to deliver a future-proof ADAS compute platform that supports the rapid advancement of automated driving, enhances vehicle safety, and aligns with the ...

サードウェーブは1月6日、最大50TOPSとなるIntel Core Ultra シリーズ3を搭載したノートPCを発表した。1月7日午前5時に予約販売を開始する。出荷時期は1月28日めど。