1 WSL Institute for Snow and Avalanche Research SLF, Davos, Switzerland 2 Institute of Mechanical Systems, ETH Zürich, Zurich, Switzerland The snow microstructure is crucial for the mechanical ...

With the trend from Si IGBT to SiC MOSFET in electric vehicle (EV) power electronics, the junction temperature is expected to increase from 150°C to 175°C with the potential to exceed 200°C. This ...

The cold sintering process (CSP) is a low-temperature consolidation method used to fabricate materials and their composites by applying transient solvents and external pressure. In this ...

Researchers at the Paul Scherrer Institute PSI have achieved a breakthrough on the path to practical application of lithium ...

At present there is no metallic ink that enables formation of conductive patterns at room temperature by a single printing step. Printing conductive features by metallic nanoparticle-based inks must ...

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TOKYO, Sep 12, 2018 - (ACN Newswire) - TANAKA Precious Metals (TANAKA Kikinzoku Kogyo) has developed a new wire forming technology capable of sintering at low temperatures using the Company's ...

Abstract: Nano-silver is a very potential electronic interconnect material, it has excellent physical and chemical properties, high thermal conductivity, and good electrical conductivity. It is not ...

When developing and producing components, relatively optimum designs or manufacturing conditions must be found, especially against the backdrop of price pressure and quality requirements. We say ...