The rise of 3D integrated circuits (ICs) and heterogeneous packaging is reshaping how automotive ICs fulfill demanding analog and sensor requirements. Whether for ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

Stress concentration analysis in composite and orthotropic plates is a critical area of research that addresses the localisation of stress in regions of geometric discontinuity, such as holes or ...

Theory of elasticity: elastic stability, principal of minimum potential energy, Raylegh-Ritz methods. Introduction to finite element methods of stress analysis: computer implementation and use of ...

This Technical Note explores Stress Testing and Systemic Risk Analysis for the Indonesia Financial Sector Assessment Program. The financial system is relatively small and dominated by banks with high ...