Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...

Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

Siemens Digital Industries Software is adopting a new approach for sharing accurate thermal models of IC packages to the electronics supply chain. The main advantages are protecting IP, enhancing ...

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications ...

Linear Technology Corporation and Microbonds have announced successful qualification of Microbonds X-Wire insulated wire bonding technology to enable design flexibility for Linear Technology’s ...

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...

Acoustic microscopy has the capability to detect gap thicknesses in materials as small as 0.01 micron. A contract manufacturer (CM) assembling PC boards began experiencing electrical failures that ...