For decades, optical inspection has been the primary method for process control in fabs. However, the move to multi-level interconnects and 3D transistor designs means that many killer defects are no ...
As semiconductor manufacturers aim to produce devices at the 5-nanometer node, the ability to find tiny defects created inadvertently during the fabrication process becomes harder. In addition, there ...
Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...
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