Abstract: Developing manufacturing methods for flexible electronics will enable and improve the large-scale production of flexible, spatially efficient, and lightweight devices. Laser sintering is a ...
The cold sintering process (CSP) is a low-temperature consolidation method used to fabricate materials and their composites by applying transient solvents and external pressure. In this ...
1 WSL Institute for Snow and Avalanche Research SLF, Davos, Switzerland 2 Institute of Mechanical Systems, ETH Zürich, Zurich, Switzerland The snow microstructure is crucial for the mechanical ...
At present there is no metallic ink that enables formation of conductive patterns at room temperature by a single printing step. Printing conductive features by metallic nanoparticle-based inks must ...
Abstract: Nano-silver is a very potential electronic interconnect material, it has excellent physical and chemical properties, high thermal conductivity, and good electrical conductivity. It is not ...
TOKYO, Sep 12, 2018 - (ACN Newswire) - TANAKA Precious Metals (TANAKA Kikinzoku Kogyo) has developed a new wire forming technology capable of sintering at low temperatures using the Company's ...
When developing and producing components, relatively optimum designs or manufacturing conditions must be found, especially against the backdrop of price pressure and quality requirements. We say ...
The reaction dynamics of a liquid–solid interface with the example of an acetic acid/water solution interacting with a ZnO(101̅0) surface was investigated using ReaxFF reactive force field-based ...
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