TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science ...

From smartphones and cars to AI data centers, medical equipment, satellites, and industrial automation systems, semiconductor chips are the invisible brain behind every intelligent system. As ...

V5 Technologies, a leading maker of advanced semiconductor inspection equipment centered on AI algorithms, is capitalizing on the explosive growth in advanced process and packaging demand. The company ...

Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH. This strategic integration unites Kurtz ...

TOKYO, Nov. 13, 2025 /PRNewswire/ -- On November 13, 2025, Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as "Taiyo Holdings"), based in Tokyo, presented a paper, co-authored ...

LG Chem announced on September 29 that it has completed the development of a liquid PID (Photo Imageable Dielectric), a key material for advanced semiconductor packaging, and is set to actively target ...

TAIPEI (Taiwan News) — Cheng Mei Materials Technology Chair Sung Yen-i (宋妍儀) said the company is undergoing a transformation ...

FREMONT, Calif., Feb. 26, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. ("ACM”) (NASDAQ: ACMR), a leading supplier of wafer and ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

Dr. Lee Chunheung, recognized as one of the top experts in semiconductor packaging, has been appointed to lead the Korean semiconductor equipment company HPSP. On September 29, HPSP announced that Dr.