Learn how multi-scale insights from AFM and AFP enhance hybrid bond integrity and device performance.

KD Market Insightsは、「半導体ボンディング市場の将来動向および機会分析：2025年～2035年」と題した市場調査レポートの公開を発表しました。本レポートの市場スコープは、現在の市場動向および将来の成長機会に関する情報を網羅しており、読者が十分な ...

BE Semiconductor Industries (ENXTAM:BESI) drew fresh attention after reporting a rise in preliminary fourth quarter orders to ...

COHERENT THERMAL MANAGEMENT PORTFOLIO WITH HIGH-PERFORMANCE BONDABLE DIAMOND SOLUTIONS Coherent announced the launch of its ...

Hanmi Semiconductor has drawn industry attention in recent years for its thermal compression bonding equipment used in ...

Sumitomo Bakelite Co. (Tokyo) announced plans to acquire all shares of a company newly established by Kyocera Corp., and ...

"Driven by AI accelerators, automotive ECUs, and edge computing, the global semiconductor silicon wafer market sees rising demand for 300mm, 200mm, and 100mm wafers, with advanced manufacturing ...

BE Semiconductor Industries posts €250 million Q4-25 orders, up 105% YoY, driven by data-center and photonics demand. Strong H2-25 growth outlook.

Chip equipment manufacturer BE Semiconductor Industries, based in Duiven in the province of Gelderland, saw its order revenue rise by 43 percent to €250 ...

Analysts remains positive on Mi Technovation Bhd, as they see the group's diversification strategy "falling into place" and ...