QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...

Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...

Energy Research SubscriptionAdditivi per batterie agli ioni di litio e batterie prive di PFASSensori avanzati per pacchi batteria e monitoraggio remotoBatterie avanzate agli ioni di litioTecnologia ...

The electric vehicle market is expanding. As a consequence, the market for power modules within all manner of electric vehicles is expanding. This, in turn, will translate into rising demand for ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...