The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

TIANJIN — Chinese researchers have achieved a breakthrough in micro-LED wafer testing by developing a nondestructive detection method, thereby addressing a longstanding challenge in ...

Hermes Testing Solutions Inc. (HTSI), a provider of semiconductor wafer testing solutions, said demand for flexible and highly customized testing equipment is increasing as advanced process nodes ...

IC sense opens a new Electronic Wafer Sort (EWS) cleanroom to expand its in‑house ASIC production capabilities.

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

Semiconductors are the essential component fueling the growth of industries such as automotive, renewable energy, communications, information technology, defense, and consumer electronics. The rise of ...

FREMONT, CA - Aehr Test Systems (NASDAQ:AEHR), a global provider of semiconductor test and burn-in equipment, announced today that it has secured an initial production order from a leading automotive ...

Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during ...

The Wafer Process Control Equipment Market, valued at USD 7.93 billion in 2023, is expected to grow to USD 13.15 billion by 2031, exhibiting a CAGR of 6.52% from 2024 to 2031. This growth is driven by ...

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