Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor ...

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

Micron Technology Inc. today began offering samples of a SDRAM die in wafer-level chip-scale packaging (WLCSP). The packaging process makes Micron one of the only memory manufacturers capable of ...

According to the SNS Insider Report, “The Interposer and Fan-out Wafer Level Packaging Market was valued at USD 32.38 billion in 2023 and is projected to reach USD 88.77 billion by 2032, growing at a ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

PSMC plans to integrate advanced packaging technologies and materials—3D Wafer-on-Wafer (WoW) and Interposers—to pivot into a ...

PHOENIX, Oct. 07, 2025 (GLOBE NEWSWIRE) -- SEMICON WEST -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...