Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

The Fraunhofer Institute for Photonic Microsystems (IPMS), in collaboration with DIVE imaging systems , has achieved a major milestone in resource-efficient semiconductor manufacturing. With the ...