Abstract: Tin-plated copper structure was widely applied in the electronic products. With the development of the electronics industry, the integration degree increased and the component size reduced ...

Tin-plated copper structure was widely applied in the electronic products. With the development of the electronics industry, the integration degree increased and the component size reduced obviously.

Newly redesigned lead-free formulation delivers industry-leading plating rates, enhanced plating performance, bath stability and greater process flexibility for advanced packaging applications ...

This file type includes high resolution graphics and schematics when applicable. Tin whiskers are slim metallic filaments that emanate from the surface of tin platings (see the figure). These ...

The electroplating intermediate is a material used in the electroplating process to adjust characteristics such as grain size, gloss, thickness and plating speed. Most of them are configured as ...