Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and ...

Scientists of the Engineering School of Non-Destructive Testing and Safety of TPU have developed a new effective method of thermal non-destructive testing of composites used in the aerospace industry.

Multi-die designs, 2.5D and 3D, have been rising in popularity as they offer tremendously increased levels of integration, a smaller footprint, performance gains and more. While they are attractive ...

LANZHOU -- A new study by Chinese scientists has shed light on the coupling effects of snow cover and ground thermal on the Qinghai-Tibet Plateau, according to the Northwest Institute of ...