The rise of 3D integrated circuits (ICs) and heterogeneous packaging is reshaping how automotive ICs fulfill demanding analog and sensor requirements. Whether for ...

Modeling how cars deform in a crash, how spacecraft responds to extreme environments, or how bridges resist stress could be made thousands of times faster thanks to new artificial intelligence that ...

At advanced nodes and in the most advanced packages, physics is no one’s friend. Escalating density, smaller features, and thinner dies make it more difficult to dissipate heat, and they increase ...

Stress Engineering Services, Inc (SES), a global leader in delivering complex engineering services and solutions, has launched SES Renewables Solutions, a new group dedicated to providing engineering ...