Soldering conditions for individual products depend on factors such as package, printed circuit board, soldering method and the equipment used. This note will provide you a quick overview of the ...

Abstract: A micro soldering method based on micro gripping was developed to improve strength between bonding pad and wire. The designing and working principle of micro soldering set-up were based on ...

Soldering is the process of using a metal alloy with a low melting temperature (solder) to fuse the electrical contacts of a component to the pads of a circuit board. Proper soldering maximizes the ...

Product Briefing Outline: Reis Robotics has now implemented a newly developed laser soldering procedure for practical use with several customers. Photovoltaics manufacturers are increasingly anxious ...

Abstract: With the miniaturization of electronic products, solder joints on consumer circuit boards have become denser, with sizes reaching the millimeter scale. Accurate temperature measurement is ...