Solder paste printing needs to be realized through a stencil. The stencil opening needs to be aligned with the substrate pad to achieve accurate printing. It can be said that the stencil quality has a ...

Abstract: We discuss the design considerations of the stencil openings and the dimension of the bond pads on the PCB for the solder paste printing in the assembly process of high density LED display ...

[Jan Mrázek]’s success with 3D printing a solder paste stencil is awfully interesting, though he makes it clear that it is only a proof of concept. There are a lot of parts to this hack, so let’s step ...

A PCB stencil provides a template that goes over the PCB and has openings only where solder paste needs to be applied. With a glob of solder paste and a squeegee, an entire board can have the solder ...

Mini LED chips can measure as small as 50μm × 100μm, with pad spacing as narrow as 5-50μm, demanding extreme precision in ...

Hobby electronics manufacturer SparkFun has started offering various classes at their Boulder, CO facility. [Landon] has been attending as many as possible and posted about his experience during their ...

Abstract: Current technology drivers span a broad spectrum that include miniaturized hand-held devices where real estate is at a minimum as well as high density server assemblies that have ...

Preventing plating and soldering voids is about testing new manufacturing processes and analyzing the results. Plating and soldering voids usually have an identifiable cause, such as the type of ...