The integration of large-area power modules with an area of over 100 mm² is highly relevant. These modules are of great importance for various applications in e-mobility ... Ultrasonic die bonding ...

Nabertherm GmbH, headquartered in Lilienthal, Germany, has published a guide outlining the debinding and sintering stages in the Metal Injection Moulding process, along with the furnace technology it ...

Abstract: Pressure copper (Cu) sintering paste with high shear strength, high thermal/electrical conductivity, and positive reliability was developed for high-power device die-attach applications. The ...

Sikama International announces product support for copper and silver sintering applications used in the power electronics and EV markets. Sikama International's equipment is the perfect fit for ...

A centuries-old materials bonding process is being tested aboard the International Space Station in an experiment that could pave the way for more materials research of its kind aboard the orbiting ...