Chemical Mechanical Planarization (CMP) is a critical process in the semiconductor, LED wafer, and hard disk manufacturing industry and is used to achieve the substrate wafer's required planarity.
Abstract: Accurate and real-time thickness measurement of metal film on Si-based wafer improves the global planarization by adjusting the polishing pressure and avoids over-polishing and ...
Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
Abstract: In this paper we have proposed a way of a model-based CMP proximity correction in sub-28nm SoC (system-on-a-chip) designs. Just like OPC (optical proximity correction) process against ...
The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) ...
One definition of design for manufacturing (DFM) is providing knowledge about the impact of the manufacturing process on a design layout to the designers, so they can use that information to improve ...
Machine learning (ML), neural networks (NNs), and deep learning have many applications in different areas of modern industry and life. Their ability to “learn” how to analyze and predict imprecise ...
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