Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Two case studies show the effectiveness of high-res 3D ...

Demand for advanced electronics, increased functionality, and compact designs is significantly accelerating the adoption of three-dimensional （3D） semiconductor packaging solutions. This packaging ...

SK Hynix has announced a major investment of $12.90 billion, to build an advanced semiconductor packaging plant in South ...

IDTechEx（先進技術調査会社: 本社英国 ケンブリッジ）は、「先端半導体パッケージングの材料とプロセス 2024-2034年」と題した調査レポートを発行し、2023年6月28日より、日本法人のアイディーテックエックス株式会社（東京都千代田区）での販売を開始しまし ...

Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...

The company said the proposed facility will cater to semiconductor devices used in optical and optronic systems for defence ...

SK hynix on Tuesday confirmed the construction of its new semiconductor packaging fab, dubbed P&T7, in Cheongju, North ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

In October 2023, 123 years after Toppan Printing was founded in Tokyo in 1900, the group was reorganized into a holding company structure with Toppan Inc. as the core operating company. Based on a ...

New subsidiary to focus on advanced semiconductor packaging for defence and strategic electronics – Paras would be setting up India’s first advanced heterogeneous & 3D packaging ...

In the past week, TOPPAN Holdings and subsidiary TOPPAN Inc. highlighted their advanced semiconductor packaging and photomask technologies at SEMICON Japan 2025, alongside an electronics business ...

As of Monday, several A-share-listed semiconductor makers had released earnings estimates for 2025, with many indicating year-on-year growth, the Securities Daily reported on Tuesday. A Chinese expert ...