Ottawa, Dec. 05, 2025 (GLOBE NEWSWIRE) -- According to a recent analysis by Towards Packaging, the global semiconductor assembly packaging equipment market is projected to expand from USD 5.35 billion ...

Hanwha Semitec expressed its ambition to secure leadership in the next-generation advanced semiconductor packaging equipment market by launching its second-generation hybrid bonder early next year.

In the semiconductor industry, the outsourced semiconductor assembly and test (OSAT) sector plays a pivotal role in the global technology landscape. As the backbone of electronic device manufacturing, ...

Vietnam is moving beyond its long-standing focus on assembly and testing to integrate more deeply into the global semiconductor value chain, as AI accelerates demand for advanced chips. AI is emerging ...

India’s first pilot line that will handle end-to-end chip assembly, packaging, testing and post-test services, became operational at a newly built Outsourced Semiconductor Assembly and Testing (OSAT) ...

As part of the agreement, Tata Electronics and C-DAC will explore opportunities for collaboration to develop the semiconductor design and IP ecosystem in India, utilising Tata Electronics' fab ...