Dublin, Jan. 21, 2026 (GLOBE NEWSWIRE) -- The "Power Module Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026-2031)" has been added to ResearchAndMarkets.com's ...
A new technical paper titled “Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging” was published by researchers at ...
A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
(MENAFN- GlobeNewsWire - Nasdaq) The market presents opportunities in EV traction inverters with the rise of SiC & GaN devices, industrial motor drive energy efficiency, and regional diversification ...
Editor’s Note: This two-part series covers 11 different power module releases in 2025. The article is split for readability, with Part 2 continuing the manufacturer roundup. Silicon carbide (SiC) ...
The "Automotive-Grade Power Semiconductor and Module (SiC, GaN) Industry Research Report, 2025" has been added to ResearchAndMarkets.com's offering. SiC/GaN research indicates a significant uptick in ...
As design engineers transition to SiC power solutions, Microchip Technology has announced the MPLAB – a SiC Power Simulator. With electrification driving the growth of SiC semiconductors designers ...
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