The objective of this article is to explain the best techniques for soldering sensors manufactured by Merit Sensor using automated equipment. All profiles must be assessed and tested for best ...

A new technical paper titled “Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging” was published by researchers at Sungkyunkwan University and ...

In a conventional lead-free soldering process reflow ovens operate continuously at about 260°C. An effective alternative capable of operating at a lower temperature could significantly reduce the ...

Abstract: The paper presents the results obtained by the authors in order to optimize the reflow soldering process using nitrogen to assure high quality lead free joints between the pins of the SMT ...

Article subjects are automatically applied from the ACS Subject Taxonomy and describe the scientific concepts and themes of the article. Glass substrates have gained considerable attention as ...

In the surface assembly process of electronic products, especially in the high-volume reflow soldering process, the tombstone effect of passive chip components to the PCBA assembly soldering adds a ...

OLDHAM, UK – Solderstar, a global leader in temperature profiling equipment for soldering processes, is set to showcase its latest innovation, the Reflow Shuttle with O2 measurement module, at the IPC ...