Abstract: In view of the complexity and high cost of temperature curve setting in reflow soldering process of multi variety and small batch products, and the existing process simulation methods of PCB ...

Abstract: Due to the promotion of the globalization of environmental protection process, some high reliability requirements of electronic products have to be passive to the backward compatible ...

Fujitsu Limited and Fujitsu Nagano Systems Engineering Limited today announced the release of SimPRESSO/RFL, a new software package in Japan that enables easy analysis of the temperature distribution ...

The overall concept of reflow soldering is simple: put a pre-assembled board with some solder paste into an oven and bake it until the solder properly melts. When a board is reflowed, it typically is ...

In the surface assembly process of electronic products, especially in the high-volume reflow soldering process, the tombstone effect of passive chip components to the PCBA assembly soldering adds a ...

Reflow Soldering Guidelines for Lead-Free Packages Application Note 353 July 2004, ver. 1.0 Introduction The recent directives and legislations by nations around the world have mandated elimination of ...