KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation in the 2024 IPC APEX EXPO, scheduled to take ...

カリフォルニア州フリーモント, 2024年6月28日 /PRNewswire/ -- 先端半導体パッケージング用途向けのプロセス装置の ...

VeroTherm FARシステムは、フラックスレスはんだおよびマスリフロー・プロセスを用いて、10ミクロン未満のマイクロバンプ構造を実現するためのソリューションを提供するよう設計されています。このシステムは、積層ロジックや高帯域幅メモリ（HBM）など、AIアクセラレータにおける先端 ...

The solders used in the Electronic Industry are rapidly changing from Tin/Lead (Sn/Pb) solders to Lead-Free (Pb-Free) solders to meet new environmental and Green requirements. Many of these ...

In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is ...

A proprietary reflow metallization process involves plating pure tin overcopper or brass substrates. Lead-free plating of strip and wire is available for a variety of industrial applications. Using a ...

This paper will address the optimization of Pb Free soldering conditions, with a focus on differences between Sn/ Pb and Pb Free soldering. This allows assemblers to build on their extensive ...