Austin, Oct. 20, 2025 (GLOBE NEWSWIRE) -- Power Module Packaging Market Size & Growth Insights: According to the SNS Insider,“The Power Module Packaging Market size was valued at USD 2.53 Billion in ...

Consumer electronics lead the Power Module Packaging market holding a share of around 29%, reflecting their widespread use in compact, high-performance devices. Renewable energy systems are growing ...

TI、新しいパワーモジュール向け磁気部品内蔵パッケージングテクノロジーを開発、電源ソリューションのサイズを半分に削減 MagPack(TM)テクノロジーを採用した新しいパワーモジュールは、前世代製品と比べて最大50%小型化され、優れた放熱特性を維持し ...

Dublin, Jan. 21, 2026 (GLOBE NEWSWIRE) -- The "Power Module Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026-2031)" has been added to ResearchAndMarkets.com's ...

The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

The module is packaged in an innovative vertical construction that maximises board space efficiency and can provide up to a 40% board area reduction when compared to other solutions. The compact power ...

Microchip ...

[NASDAQ: MCHP] - eモビリティ、持続可能性、データセンター市場では量産可能な製品が求められます。実装工程の自動化を促進するため、よく使われるのがプレスフィット端子で、これはパワーモジュールをはんだ付けしないでプリント基板に取り付ける ...