Dow Electronic Materials has launched its first chemical mechanical planarisation (CMP) polishing pads from its IKONI 2000 and IKONIC 3000 series. All pads in the IKONIC CMP polishing pad platform are ...
PHOENIX, Arizona — Semiconductor polishing company Rodel Inc. has introduced a polishing pad for direct shallow trench isolation (STI) and pre-metal dielectric chemical mechanical planarization (CMP) ...
Dow Electronic Materials, today introduced the OPTIVISIONTM 4540 CMP Polishing Pad designed to deliver low defectivity and low cost of ownership (CoO) over pad lifetime. The new pad is formulated with ...
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