Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

LoginForgot password?Send Reset LinkBack to login. 1.19. Overview of Cooling Strategies for High-Power 2.5D/3D Packages - 1 1.20. Overview of Cooling Strategies for High-Power 2.5D/3D Packages - 2 ...

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U.S. semiconductor companies were among the first to respond by disaggregating large chips into smaller, specialized chiplets ...

Semicon USA highlights how chips are central to new tech like AI and faster internet. The way chips are put together, called advanced packaging, is changing chip design and making things more ...

FPT Announces the Establishment of an Advanced Semiconductor Testing & Packaging Plant ...

SEOUL, South Korea, July 15, 2025 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced today that it has successfully co-developed core technology and completed reliability ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

TOKYO, JAPAN - Media OutReach Newswire - 27 March 2025 - Toray Engineering Co., Ltd.,has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging "PLP ...

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...