As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing ...

2024年12月16日、英国ロンドン発-エンタープライズクラウドおよび産業用AIソフトウェアのリーディングテクノロジープロバイダーであるIFSは本日、米国を拠点とするパッケージメーカーのGreen Bay Packaging (GBP) が、資産の信頼性を高め、調達機能を改善するため ...

LoginForgot password?Send Reset LinkBack to login. 1.19. Overview of RDL L/S range by different RDL formation technology (1) 1.20. Overview of via diameter range by different microvia creation ...

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of ...

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AblePrint Technology (APT), which has long focused on semiconductor packaging and offers pneumatic and thermal process solutions, has opened a new plant in Hsinchu, northern Taiwan, in response to ...

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance Computing ...