Although consumers care about the products they buy, the packaging matters, too. It is a similar concern for company leaders. An insufficient package could result in goods arriving spoiled, broken or ...

This system is capable of packaging chips with a high accuracy of ±0.8μm using thermal compression bonding “TCB” on 515mm × 510mm and 600mm × 600mm panels complying with the SEMI Standards. It can ...

TOKYO, JAPAN - Media OutReach Newswire - 27 March 2025 - Toray Engineering Co., Ltd.,has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging "PLP ...

Arlington, Virginia--(Newsfile Corp. - December 10, 2025) - The AAMI Foundation is pleased to announce the launch of the Michael Scholla Packaging Engineering Scholarship Fund, a new philanthropic ...

Packaging science goes far beyond mere protection and containment. It's a bridge between products and consumers, serving as a powerful tool for marketing, sustainability, and innovation. This is where ...