Abstract: One of the key processes of 3-D IC technology is the implementation of a temporary bonding solution that gives the ability to handle and process thinned Si wafers. Figure 1 depicts thin ...

Abstract: The implementation of W bit-line enabled the integration of n+ and p+ common contact process at bit-line level. Despite the advantages of the common contact process such as chip-area ...

Vancouver, Wash.,-based Sekidenko introduced its model 4000DRT Deposition Rate Tuner for online film thickness prediction and uniformity tuning of dielectric plasma enhanced chemical vapor deposition ...

From the last several lithography nodes, in the 14 to 10nm range, to the latest nodes, in the 7 to 5nm range, the requirements for patterning and image transfer materials have increased dramatically.