A new technical paper titled “Modeling and Simulating Emerging Memory Technologies: A Tutorial” was published by researchers at TU Dortmund, TU Dresden, Karlsruhe Institute of Technology (KIT) and FAU ...
Chip Industry Technical Paper Roundup: Feb. 18 Warpage in wafer-level packaging; NVM tutorial; GAAFETs; uncore frequency scaling for heterogeneous systems; simulation of vertically stacked 2D ...
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