The Metal Injection Molding (MIM) process is a game changer in manufacturing. It combines the design flexibility of Plastic Injection Molding with the strength and integrity of wrought metals, ...
MAKUHARI, Japan — NEC Electron Devices has unveiled a 0.13-micron full-metal DRAM process technology that can build 450-MHz embedded DRAM circuitry running at 1.2 volts. NEC expects to confirm the ...
A multilayer technology developed by substrate manufacturer Lamina Ceramics (Westampton, NJ) enables unfired ceramic to be bonded to either Kovar or copper-molybdenum-copper (CuMoCu) metal. Offering ...
Reducing back-end-of-line (BEOL) interconnect parasitic capacitance remains a focus for advanced technology node development. Porous low-k dielectric materials have been used to achieve reduced ...
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