PENANG, Malaysia -- Top chip packaging provider ASE Technology Holding is investing $200 million to trial next-generation chip packaging technology built on square substrates, rather than traditional ...

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...

The flexible packaging market is anticipated to expand at a rapid pace owing to surging consumption of packaged foods and beverages coupled with advancements in flexible packaging materials. Surge in ...