LEUVEN, Belgium — This week, at SPIE 2023 Advanced Lithography + Patterning Conference, in San Jose, CA, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, ...

Producing modern semiconductor devices is an immensely challenging process. Successful execution entails advanced process nodes, novel device architectures, new materials, and many fabrication steps.

Nanostencil lithography (NSL) is a shadow-mask-based nanopatterning technique that allows for the direct deposition of materials through a stencil mask with nanoscale openings. It enables the ...

Continued scaling of integrated circuits to smaller dimensions is still a viable way to increase compute power, achieve higher memory cell density, or reduce power consumption. These days, chip makers ...