Traditional chips depend on flat, inflexible wafers; the Fudan team replaced these with elastic substrates capable of hosting resistors, capacitors, diodes, and transistors. Once patterned, each ...

Materials innovation drives next-gen AI chips, enabling performance, efficiency and scalability.

Semicon USA highlights how chips are central to new tech like AI and faster internet. The way chips are put together, called advanced packaging, is changing chip design and making things more ...

Companies are looking into using cleaner energy sources, like solar and wind power, to run their factories. This helps save ...

Engineers at the University of Delaware have uncovered a way to bridge magnetism and electricity through magnons—tiny waves that carry information without electrical current. These magnetic waves can ...