GPUs, ASICs, and other AI processors require enormous amounts of power delivered at low voltages and high currents.

New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

For extra-powerful, high-efficiency inverter systems in railcars, electric power systems and more Mitsubishi Electric’s SBD-embedded SiC-MOSFET modules, including the 3.3kV/800A version released on ...

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...

Flex Power Modules has expanded its production footprint to Europe, establishing new manufacturing operations at Flex’s facility in Althofen, Austria. Flex Power Modules opens Austrian manufacturing ...

HUDSON, Mass., June 23, 2025 /PRNewswire/ -- Diamond Technologies, Inc (DTI), a leading provider of embedded solutions to OEMs, is thrilled to announce the launch of its new line of Embedded Computing ...

For extra-powerful, high-efficiency inverter systems in railcars, electric power systems and more Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has begun shipping low-current 3 ...

Tria Technologies is launching COM-HPC Mini computer modules at Embedded World next week. At there heart are Intel 13th generation Core H, P or U series processors, enabling “system designers to pick ...