TOKYO — During the Semicon Japan trade show here today, nLine Corp. rolled out its first product–a wafer inspection tool, based on a new and radical holographic imaging technology. The new ...

WATERLOO, Ontario, April 05, 2022 (GLOBE NEWSWIRE) -- Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is pleased to announce the release of its multispectral Camera Link HS (CLHS) line ...

BEIJING, Aug. 31, 2023 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WIMI) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced that ...

Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...

The first SWIR line scan camera from Teledyne DALSA offers up to 74 dB dynamic range and spectral response from 950 to 1700 nm With exceptional responsivity and low noise, this newest Linea SWIR line ...

Teledyne DALSA introduces its Linea ML 8k multispectral CLHS line scan camera for improved defect detectability with a single scan. Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is ...

MILPITAS, Calif., July 20, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the revolutionary eSL10™ e-beam patterned-wafer defect inspection system. The new system is designed to ...

Some fabs build consumer chips that sit inside phones and laptops. Others build chips that must survive in orbit, under the Arctic ice, or deep beneath the Earth’s surface. Fabs serving defense, ...

Electron-beam inspection is proving to be indispensable for finding critical defects at sub-5nm dimensions. The challenge now is how to speed up the process to make it economically palatable to fabs.