Abstract: Decapsulation of packaged integrated circuits is routinely conducted in failure analysis and reliability tests. In this work, we report on decapsulation of a complex packaged semiconductor ...

Decapsulation of plastic IC packages in different types and size were performed by wet chemical technique. Studied devices were to use in satellites and going to subject a series of test which require ...

SAN DIEGO, Oct. 31, 2024 /PRNewswire/ -- Nisene - A Division of Polymatech Electronics, a global pioneer in semiconductor chip manufacturer headquartered in Chennai, India, today announced the launch ...