Decapsulation of plastic IC packages in different types and size were performed by wet chemical technique. Studied devices were to use in satellites and going to subject a series of test which require ...

Abstract: Decapsulation is a failure analysis technique often used to expose the die and first-level interconnects such as wirebonds by dissolving the surrounding epoxy molding compound (EMC). The wet ...

A systematic approach to nonconventional methods of encapsulant removal. An unfortunate reality is that the circuits we assemble do not always perform as expected. Failure analysis is frequently ...

This project implements a simulation and animation framework to demonstrate the processes of encapsulation and decapsulation in the OSI model. The framework provides a visual and interactive ...