Abstract: Advanced packaging suppliers are having two primary challenges during IC substrate fabrication, meeting the requirements on copper plating performance and reducing the cost from ...

Abstract: Typically, industrial electroless copper plating solutions use formaldehyde as a reducing agent. However, since formaldehyde has a strong odor and is a carcinogenic substance, it has an ...

Avoiding via failures caused by barrel plating separation. PCB manufacturers face challenges in the precise registration of multiple layers, which is required to ensure reliable interconnects, and in ...

Improvements in the deposition of copper will usher in new ultralarge-scale ICs. Copper has become the material of choice for fabricating connections on ultralarge scale integrated circuits. The ...

Cyclic voltammetric stripping (CVS) analysis can be used to facilitate the detection of mercaptopropylsulfonic acid (MPS). MPS is the breakdown product of bis ...