Abstract: Void-free electroplating of copper in high-aspect ratio via structures is an important capability for achieving high-reliability through silicon vias (TSVs). In this study, the evolution of ...

This masterclass will explore the principles of electrochemistry through the process of electroplating. Together with the students, we will perform copper electroplating on 3D-printed miniatures (e.g.

San Jose, California – October 20, 2009 – Novellus Systems (NASDAQ: NVLS) today introduced the SABRE Excel, an advanced copper electroplating system designed to provide industry-leading fill and ...

Electroplating is a technique that uses an electrical current to deposit a thin layer of metal onto a surface. It is widely used across industries to enhance material properties, such as durability, ...

Fraunhofer ISE development also uses recyclable aluminum for masking – removing need for problem polymers. Thin copper contacts mean the silicon layer does not experience much shading. The rising ...

Abstract: As the electronic products become multi-functional and complicated, relatively high-density pattern must be designed to meet these requirements. As a result, multilayer printed circuit ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...