Abstract: Package on Package (PoP) is one of the increasingly used high density package solution for package stacking technology in various device manufacturing applications. Normally PoP ...

Abstract: Liquid Compression Mold Underfill (LCMUF) is a liquid encapsulation material that was developed to encapsulate wafer-level packages of 12-inch silicon wafers using a compression molding ...

Injection overmolding of unidirectional fibers and preforms is an attractive process for many good reasons. It’s fast, consistent and repeatable, and it can be performed with a machine that is ...

NEW YORK (May 1, 5 p.m. ET) — Amcor Rigid Plastics is producing pharmaceutical packaging using compression blow forming technology, making it the first company to use a CBF machine on a commercial ...

In the realm of compression molding of Carbon Fibre Reinforced Composite (CFRC) laminates, pivotal technological challenges related to product quality monitoring are addressed in this study, a ...