Abstract: Liquid Compression Mold Underfill (LCMUF) is a liquid encapsulation material that was developed to encapsulate wafer-level packages of 12-inch silicon wafers using a compression molding ...

NEW YORK (May 1, 5 p.m. ET) — Amcor Rigid Plastics is producing pharmaceutical packaging using compression blow forming technology, making it the first company to use a CBF machine on a commercial ...