Abstract: Liquid Compression Mold Underfill (LCMUF) is a liquid encapsulation material that was developed to encapsulate wafer-level packages of 12-inch silicon wafers using a compression molding ...

Owens-Illinois Inc. is launching a pioneering effort to compression mold billions of preforms on proprietary equipment that the company said could lower production costs significantly. The project - ...

Amcor Rigid Plastics is producing pharmaceutical packaging using compression blow forming technology, making it the first company to use a CBF machine on a commercial scale, the company announced at ...