NEC introduced the M2 system LSI chip that integrates third generation (3G to 3.5G) W-CDMA and HSDPA communications technologies with application functions, with advanced low power technologies ...
Interesting Engineering on MSN
Smart chip could slash computing energy use by up to 5,000×
Researchers in Italy have recently developed a new smart chip that could greatly reduce ...
Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption continues to climb.
NL, the funding accelerates mass production of Qualinx’s QLX3Gx Series 3 chip, strengthening Europe’s semiconductor sovereignty and bringing affordable, ultra-low-power connectivity to every ...
Data centers and high-performance computing (HPC) are the primary enablers of today’s power-hungry AI-driven technology, but chip designers, EDA vendors, and the data centers themselves have a long ...
KDマーケット・インサイツは、「インパッケージチップ電源市場の将来動向と機会分析 ― 2025年から2035年」を題した市場調査レポートを発表いたします。本レポートの市場範囲には、現在の市場動向および将来の成長機会に関する情報が含まれており、読者 ...
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